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IPC-TM-650
Test Methods Manual

Contains over 150 industry approved test techniques and procedures for chemical, mechanical, electrical, and environmental tests on all forms of printed boards and connectors. Note: this is an exception to IPC's standard single user license and the test methods may be printed from the CD.

Pris: 3624 kr (bok), 3664 kr (utskrivbar CD).

IPC-TR-585
Time, Temperature and Humidity Stress of Final Board Finish Solderability

This Technical Report details the investigations into identifying stress tests that distinguish between robust and non-robust surface finishes. A robust finish will pass a test for solderability whereas a non-robust finish will fail. The stress tests identified do not necessarily duplicate real world environment (fabrication of the bare printed board through assembly), but they must correlate to solderability performance. The Sequential Electrochemical Reduction Analysis (SERA) was used extensively to evaluate the solderability performance of the finishes after stress exposure. 54 pages. Released May 2006.

Pris: 656 kr (CD). Finns inte som bok.

 IPC-9691A
 User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance Test (Electrochemical Migration Testing)

This user document provides guidance regarding how the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance Test can best be used for evaluating the effects of mechanical stress, laminate material fracturing, ionic contamination, moisture content prior to press lamination, and other material processing characteristics on conductive anodic filament (CAF) test method results. This CAF test method provides a proven standard for determining the risk of temperature, humidity and bias (THB) failure within rather than on the surface of printed circuit boards (PCBs), typically filament formation along the boundary between the resin and laminate reinforcement. 23 pages. Released August 2007.

Pris: 496 kr (bok), 536 kr (CD), 824 kr (Bok + CD).

IPC-5701
 Users Guide for Cleanliness of Unpopulated Printed Boards  

Tackling PCB cleanliness is a tough job; residues on printed circuit boards are directly related to the reliability of the produced hardware and can result in serious failures if not known or monitored. But how do you measure "cleanliness"? How clean is "clean"? The IPC-5701 provides guidance into how these issues should be approached and specified in purchasing documents, addressing levels of cleanliness, how to specify them, common locations for testing, and information on sample sizes.

Pris: 416 kr (bok), 456 kr (CD).

  
IPC-5704
Cleanliness Requirements for Unpopulated Printed Boards

 Printed board quality encompasses many parameters, cleanliness being one important parameter. This document defines the recommended general requirements for the cleanliness of unpopulated (bare) single, double-sided and multilayer printed boards. Coverage is given to Ion Chromatography (IC) testing and Ionic cleanliness testing for process control. 6 pages. Released December 2009.
Pris: 416 kr (bok), 456 kr (CD).

 IPC-5702
Guidelines for OEMs in Determining Acceptable Levels of Cleanliness of Unpopulated Printed Boards

 Every electronics manufacturer, whether an original equipment manufacturer (OEM) or electronics manufacturing services (EMS) company, must determine if the unpopulated printed boards entering the assembly process have an adequate level of cleanliness. The question of “how clean is clean enough?” is one that has no definitive answer, as there is no "golden number" for board cleanliness. The issue is a very complex topic, with many critical considerations, and so a single methodology to determine acceptability does not exist. Recognizing this, IPC-5702 has been written to give the printed board or printed board assembly professional some guidance on how to correlate cleanliness related data to electrical function and determine “acceptable” cleanliness levels. 15 pages. Released June 2007.

 Pris: 416 kr (bok), 456 kr (CD).

IPC-CH-65A
 Guidelines for Cleaning of Printed Boards & Assemblies  

A road map for current and emerging cleaning issues in the electronics industry. This handbook includes description and discussion of various cleaning methods. It explains the relationship between materials, processes and contaminants in fabrication and assembly operations. It also addresses cleanliness assessment and process control in relation to cleanliness. 56 pages. Revised August 1999.

Pris: 496 kr (bok), 536 kr (CD).