Die attach

Die attach

Datacon 2200 evo plus multichip die bonder

  • Highest accuracy ± 7 µm @ 3 Sigma
  • Uptime>98 %, yield > 99.95 %
  • Die attach, flip chip, multichip in one single machine
  • Die can be picked from wafers, waffle/gelpack, feeder and placed on boat, substrate, PCB, wafer, etc
Datacon 2200 evo plus
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Datacon 2200 evo multichip die bonder

  • High accuracy ± 10 µm @ 3 Sigma
  • Die attach, flip chip, multichip in one single machine
  • Die can be picked from wafers, waffle/gelpack, feeder
  • Die can be placed on boat, substrate, PCB, wafer, etc
Datacon 2200 evo
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Datacon 8800 Flip Chip Smart Line

  • RFID high speed placement line
  • Adhesive dispensing system with ± 25 µm accuracy
  • Capability down to 0.3 mm die size with accuracy of 15 µm @ 3s
  • Handles 6”, 8” and 12” wafers as standard
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Molding

Fico AMS-W Map Molding system

  • Molding system for QFN, BGA, BOC and BGA-MAP
  • Including Flip Chip, Multi Chip array and Stacked Die
  • Cleanroom class 1000
Fico AMS-W
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