IPC standards

The Latest from IPC - November 2017 - new Rev G releases!

IPC-A-610 rev G Acceptability of Electronic Assemblies
IPC-J-STD-001 rev G Requirements for Soldered Electrical and Electronic Assemblies


IPC-A-610 rev G and IPC-J-STD-001 rev G

IPC-A-610G remains as the visual quality acceptance standard for post assembly products used in
today’s electronics industry. IPC J-STD-001G continues to be the materials and process
requirements document critical for use during manufacturing. Each standard has significant
changes and updates that keep pace with the changes within the industry. Some of these
changes include updated criteria for both through hole and surface mount in IPC-A-610.
Other changes include replacement of the “Space Shuttle Symbol” with the “International
Space Station Symbol,” and updates to the general and product assurance sections of IPC J-STD-001.
IPC-A-610 is developed in synergy with J-STD-001, and for the first time with this revision,
IPC/WHMA-A-620 for cable harnesses.

IPC-A-610 = 440 pages. IPC-J-STD-001 = 92 pages. Released October 2017.                  

All IPC standards and other IPC publications can be purchased from Scanditron.       
Scanditron has had a close co-operation with IPC since 1997 and has translated
several IPC standards to Swedish. IPC is a USA-based trade organisation
which develops the world's most widely used quality standards for electronic production.

NEW 2017 - IPC-A-620 REV C + IPC-7711/21 REV C 


Which IPC standard should I use?

See the IPC tree (new rev 2015) which shows which IPC standard refers to each stage
in circuit board manufacture or click on the headings below for more information.

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Companies in Finland, Estonia, Lithuania and Latvia can also buy IPC documents via

IPC standards for design and CAD

IPC-7351B Requirements for Surface Mount Design and Land Pattern Standard

IPC-7351B includes both the standard and an IPC-7351B land pattern calculator on CD-ROM for accessing component and land pattern dimensional data. The calculator includes the document’s mathematical algorithms so users can build a land pattern for a corresponding surface mount part quickly and accurately.The tool also allows for modification of dimensional attributes of IPC approved land patterns.

This popular document covers land pattern design for all types of passive and active components, including resistors, capacitors, MELFs, SSOPs, TSSOPs, QFPs, BGAs, QFNs and SONs. The standard provides printed board designers with an intelligent land pattern naming convention, zero component rotations for CAD systems and three separate land pattern geometries for each component that allow the user to select a land pattern based on desired component density.

Revision B now includes land pattern design guidance and rules for component families such as resistor array packages, aluminum electrolytic capacitors, column and land grid arrays, flat lead devices (SOFL and SOTFL) and dual flat no-lead (DFN) devices. The revision also discusses the usage of thermal tabs and provides a new padstack naming convention that addresses the shape and dimensions of lands on different layers of printed boards.

Purchasers also receive a 10-day trial of the IPC-7351 Land Pattern Wizard developed by Mentor Graphics, which is an advanced version of the IPC-7351B Land Pattern Calculator. The IPC-7351B Land Pattern Wizard tool enables users to not only save their land patterns within new land pattern library files, but also to instantly export land patterns to their preferred CAD format, such as Allegro, Board Station, Expedition, PADS, CADSTAR, OrCAD, Pantheon and P-CAD. 102 pages. Released June 2010.

Part No. IPC-7351 HARD COPY, IPC-7351 E(1) CD, IPC-7351-K KIT
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IPC-2221B Generic Standard on Printed Board Design

IPC-2221B is the foundation design standard for all documents in the IPC-2220 series and is included i the IPC-2220 series. It establishes the generic requirements for the design of printed boards and other forms of component mounting or interconnecting structures, whether single-sided, double-sided or multilayer. Among the many updates to Revision B are new criteria for conductor characteristics, surface finishes, via protection, board electrical test, dielectric properties, board housings, thermal stress, compliant pins, panelization and internal and external foil thicknesses. Appendix A provides new test coupon designs used for lot acceptance and quality conformance testing. 170 pages. Released November 2012.

Part No. IPC-2221 HARD COPY, IPC-2221 E(1) CD, IPC-2221-K KIT

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IPC-2220 series for Printed Board Design

The series is built around the IPC-2221B, Generic Standard on Printed Board Design, the base document that covers all generic requirements for printed board design, regardless of materials. From there, the designer chooses the appropriate sectional standard for a specific technology. IPC-2221B + all five sectional standards are included with the series: IPC-2222A, Sectional Design Standard for Rigid Organic Printed Boards; IPC-2223C, Sectional Design Standard for Flexible Printed Boards; IPC-2224, Sectional Standard for Design of PWBs for PC Cards; IPC-2225, Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies; and IPC-2226, Sectional Design Standard for High Density Interconnect (HDI) Printed Boards. This series provides coverage on material and final finish selection, current carrying capacity and minimum electrical clearances, test specimen design, guidelines for V-groove scoring, dimensioning requirements and conductor thickness requirements.

All these standards can also be bought separately. Please contact order@scanditron.se for prices.

Part No. IPC-2220 HARD COPY, IPC-2220 E(1) CD, IPC-2220-K KIT

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IPC standards for PCBs

NEW! IPC A-600J Acceptability of Printed Boards

The definitive illustrated guide to printed board acceptability! This four-color document provides photographs and illustrations of the target, acceptable and nonconforming conditions that are either internally or externally observable on bare printed boards. Make sure your operators, inspectors, and engineers have the most current industry consensus information. With 120 new or revised photographs and illustrations, revision J provides new coverage on topics such as microvia contact dimensions, plating, voiding and fill, along with updated and expanded coverage for dielectric removal (etchback, smear and wicking), plating folds, surface plating for edge connectors, SMT and BGA pads, marking, hole registration, delamination, cap plating, via fill and flexible circuits. The document synchronizes to the acceptability requirements expressed in IPC-6012D and IPC-6013C. Released June 2016.

Part No English. IPC-A-600 HARD COPY (book),  IPC-A-600 E (1) CD (CD)
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IPC-6010 series of Board Performance Documents

The IPC-6010 series includes IPC's current qualification and performance specification standards for all major types of printed boards. The series includes
IPC-6011 Generic requirements for printed boards, regardless of substrate. The IPC-6011 is supplemented by the appropriate sectional performance specification:
IPC-6012 Qualification and Performance Specification for Rigid Printed Boards
IPC-6013 Qualification and Performance Specification for Flexible Printed Boards

IPC-6015 Qualification and Performance Specification for Organic Multichip Module (MCM-L) Mounting and Interconnecting Structures;
IPC-6017 Qualification and Performance Specification for Printed Boards Containing Embedded Passive Devices
IPC-6018A, Microwave End Product Board Inspection and Test
The specifications provide surface plating/coating criteria, hole plating integrity requirements, solder mask and covercoat coverage requirements, and quality assurance provisions that include test sample frequencies and lot inspection.

Part No. IPC-6010 HARD COPY, IPC-6010 E(1) CD, IPC-6010-K KIT

Each document can be bought separately. Please contact order@scanditron.se for separate pricing.

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IPC-6011 Generic Performance Specification for Printed Boards

This specification establishes the general requirements and responsibilities for suppliers and users of printed boards. Serving as the foundation for the IPC-6010 Board Performance Documents series, it describes quality and reliability assurance requirements that must be met. For use with IPC-6012 through IPC-6018.

Part No. IPC-6011 HARD COPY, IPC-6011 E(1) CD

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IPC standards for circuit boards

IPC-A-610G Acceptability of Electronic Assemblies

IPC-A-610 is the most widely used standard for circuit board production in the world. IPC-A-610G illustrates acceptability requirements for electronic assemblies with over 814 colour images and illustrations. Topics include flex attachment, board in board, part on part, lead free, component orientation and soldering criteria for through-hole, SMT and discrete wiring assemblies, mechanical assembly, cleaning, marking, coating, and laminate requirements. 

IPC-A-610 is invaluable for all inspectors, operators and trainers. The document is used with the material and process standard IPC J-STD-001. October 2017. 440 pages.


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J-STD-001G Requirements for Soldered Electrical and Electronic Assemblies

J-STD-001G is recognized worldwide as the sole industry-consensus standard covering soldering materials and processes. This revision includes support for both traditional solder alloys and for lead-free manufacturing. The requirements for all three classes of construction are included. Full color illustrations are provided for clarity. This standard fully complements IPC-A-610G. 92 pages. Released October 2017.

Part No. J-STD-001 HARD COPY, J-STD-001 D(1) download


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IPC-7095C Design and Assembly Process Implementation for BGAs

Implementing ball grid array (BGA) and fine-pitch ball grid array (FBGA) technology presents some unique challenges for design, assembly, inspection and repair personnel. IPC-7095C delivers useful and practical information to anyone currently using BGAs or FBGAs. Many issues have become especially important due to the change in the alloys of the ball, the ball shape, and the attachment procedures. The major emphasis of Revision C is to provide information on some of the new mechanical failure issues such as cratering or laminate defects caused after assembly.

In addition to providing guidelines for BGA inspection and repair, IPC-7095C addresses reliability issues and the use of lead-free joint criteria associated with BGAs. There are many photographs of X-ray and endoscope illustrations to identify some of the conditions that the industry is experiencing in the implementation of BGA assembly processes. 165 pages. Released January 2013.

Part No. IPC-7095 HARD COPY, IPC-7095 E(1) CD, IPC-7095-K KIT


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IPC-7711/7721C Rework, Modification and Repair of Electronic Assemblies

This guide includes all procedures needed for repair and rework of electronic assemblies and printed circuit boards! New rev C includes new procedures for BGAs using focused IR Reflow Systems with integral preheater and general updates to all other procedures. Many color illustrations. 396 pages. Released January 2017.
Part No. IPC-7711/21 HARD COPY, IPC-7711/21 (E)1 CD, IPC-7711/21 (D)1 download
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IPC standards for cable assemblies

IPC-A-620C Acceptance for Cable and Wire Harness Assemblies

Major update describing materials, methods, tests and acceptance criteria for producing crimped, mechanically secured and soldered interconnections and the related assembly activities. New sections for safety wiring, safety cable, grommets, and raceways along with updated information across many of the sections. Over 700 photographs and illustrations. 428 pages. Released January 2017. 

Part No. IPC-A-620C HARD COPY, IPC-A-620 (E)1 CD, IPC-A-620 (D)1 download


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