IPC-standarder

IPC-standarder

                      
     IPC-DRM-18H-SW                                       IPC-A-610F-SE
Komponentidentifiering                          Acceptanskrav för kretskort 

Har du undrat vad LCCC eller QFN står för? Vad betyder färgbanden på motstånd?

Se IPC-DRM-18H komponentidentifieringshandbok på svenska. Läs mer

NY 2017 - rev C på IPC A-620 Acceptability of Cable assemblies
och rev C på IPC-7711/21 Rework and repair - Läs mer

IPC KATALOG - MED INFORMATION OM HUVUDSTANDARDERNA 
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Alla IPC-standarder och övriga IPC-publikationer kan köpas från Scanditron.       
Scanditron har haft ett nära samarbete med IPC sedan 1997 och har översatt
flera IPC-standarder till svenska. IPC är en USA-baserad branschorganisation
som tar fram världens mest använda kvalitetsstandarder för elektronikproduktion.

Vilken IPC-standard ska jag använda?

Se IPC-trädet  som förtydligar vilken IPC-standard som hänvisar till respektive steg
i kretskortstillverkningsprocessen eller klicka på nedanstående rubrik.

Alla IPC-dokument kan beställas

via vår webbshop

eller
order@scanditron.se

IPC-standarder för konstruktion och CAD

IPC-2220 series for Printed Board Design

The series is built around the IPC-2221B, Generic Standard on Printed Board Design, the base document that covers all generic requirements for printed board design, regardless of materials. From there, the designer chooses the appropriate sectional standard for a specific technology. IPC-2221B + all five sectional standards are included with the series: IPC-2222A, Sectional Design Standard for Rigid Organic Printed Boards; IPC-2223C, Sectional Design Standard for Flexible Printed Boards; IPC-2224, Sectional Standard for Design of PWBs for PC Cards; IPC-2225, Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies; and IPC-2226, Sectional Design Standard for High Density Interconnect (HDI) Printed Boards. This series provides coverage on material and final finish selection, current carrying capacity and minimum electrical clearances, test specimen design, guidelines for V-groove scoring, dimensioning requirements and conductor thickness requirements.

Alla dessa standarder kan också köpas separat. Kontakta gärna order@scanditron.se för priser.

Part No. IPC-2220 HARD COPY, IPC-2220 E(1) CD, IPC-2220-K KIT

Pris: Se vår webbshop

IPC-7351B Requirements for Surface Mount Design and Land Pattern Standard

IPC-7351B includes both the standard and an IPC-7351B land pattern calculator on CD-ROM for accessing component and land pattern dimensional data. The calculator includes the document’s mathematical algorithms so users can build a land pattern for a corresponding surface mount part quickly and accurately.The tool also allows for modification of dimensional attributes of IPC approved land patterns.

This popular document covers land pattern design for all types of passive and active components, including resistors, capacitors, MELFs, SSOPs, TSSOPs, QFPs, BGAs, QFNs and SONs. The standard provides printed board designers with an intelligent land pattern naming convention, zero component rotations for CAD systems and three separate land pattern geometries for each component that allow the user to select a land pattern based on desired component density.

Revision B now includes land pattern design guidance and rules for component families such as resistor array packages, aluminum electrolytic capacitors, column and land grid arrays, flat lead devices (SOFL and SOTFL) and dual flat no-lead (DFN) devices. The revision also discusses the usage of thermal tabs and provides a new padstack naming convention that addresses the shape and dimensions of lands on different layers of printed boards.

Purchasers also receive a 10-day trial of the IPC-7351 Land Pattern Wizard developed by Mentor Graphics, which is an advanced version of the IPC-7351B Land Pattern Calculator. The IPC-7351B Land Pattern Wizard tool enables users to not only save their land patterns within new land pattern library files, but also to instantly export land patterns to their preferred CAD format, such as Allegro, Board Station, Expedition, PADS, CADSTAR, OrCAD, Pantheon and P-CAD. 102 pages. Released June 2010.

Part No. IPC-7351 HARD COPY, IPC-7351 E(1) CD, IPC-7351-K KIT
 
Pris: Se vår webbshop

IPC-standarder för mönsterkort

NY! IPC A-600J Acceptability of Printed Boards

IPC-A-600 rev J
The definitive illustrated guide to printed board acceptability! This four-color document provides photographs and illustrations of the target, acceptable and nonconforming conditions that are either internally or externally observable on bare printed boards. Make sure your operators, inspectors, and engineers have the most current industry consensus information. With 120 new or revised photographs and illustrations, revision J provides new coverage on topics such as microvia contact dimensions, plating, voiding and fill, along with updated and expanded coverage for dielectric removal (etchback, smear and wicking), plating folds, surface plating for edge connectors, SMT and BGA pads, marking, hole registration, delamination, cap plating, via fill and flexible circuits. The document synchronizes to the acceptability requirements expressed in IPC-6012D and IPC-6013C. Released June 2016

IPC-A-600 rev H-SE Acceptanskrav för mönsterkort finns även på svenska, översatt av Scanditron. Den omfattar konventionella mönsterkort i FR4-material, flex, flex-rigid, metallbaskort och andra speciella mönsterkort såsom ytplana kort och mönsterkort med stansade hål. Rev H standarden är på 157 sidor och består av ett stort antal exempelbilder och figurer i färg, som med kortfattad text beskriver olika typer av defekter och vad som är acceptabelt respektive underkänt för respektive klass. Denna nya revision H har ett utökat antal färgbilder och grafik för att förtydliga kraven ytterligare. De flesta typer av avvikelser hos enkelsidiga, dubbelsidiga och flerlagerkort behandlas i IPC-A-600H, så detta dokument är med andra ord utmärkt att ha till hands vid ankomstkontroll och avsyning, men är också ett värdefullt stöddokument för inköpare och konstruktörer.

 
Part No English. IPC-A-600 HARD COPY (bok),  IPC-A-600 E (1) CD (CD)

Artnr. svenska versionen: IPC-A-600-SE HARD COPY (bok),  IPC-A-600-SE E (1) CD (CD),  IPC-A-600-SE-K KIT (bok + CD)
 
Pris: Se vår webbshop

IPC-6011 Generic Performance Specification for Printed Boards

This specification establishes the general requirements and responsibilities for suppliers and users of printed boards. Serving as the foundation for the IPC-6010 Board Performance Documents series, it describes quality and reliability assurance requirements that must be met. For use with IPC-6012 through IPC-6018.

Part No. IPC-6011 HARD COPY, IPC-6011 E(1) CD

Pris: Se vår webbshop

IPC-standarder för kretskort

IPC-A-610F Acceptability of Electronic Assemblies

IPC-A-610 är världens mest använda standard för kretskortsproduktion. IPC-A-610 rev F (aug 2014) illustrerar acceptanskrav för kretskort med över 814 färgbilder och illustrationer (86 nya eller uppdaterade). Standarden täcker bl a blyfri produktion och acceptanskrav för hålmonterat, ytmonterat, mekanisk montering, rengöring, märkning, ytbehandlingar och laminat.

This revision includes two new SMT termination styles, and changes in plated-through hole fill and BGA void criteria. Major topics include flex attachment, board-in-board, part-on-part, both lead-free and tin-lead criteria, component orientation and soldering criteria for through hole, SMT, cleaning, marking, coating and laminate requirements.

IPC-A-610 is invaluable for all inspectors, operators and trainers. Revision F has 814 photos and illustrations of acceptability criteria — 86 of them new or updated. The document is most often used with the material and process standard IPC J-STD-001. July 2014. 424 pages.

IPC-A-610 rev F  Acceptanskrav för kretskort finns nu även på svenska, översatt av Scanditron.

Part No. Rev F IPC-A-610 HARD COPY (bok),  IPC-A-610 E (1) CD (CD),  IPC-A-610-K KIT (bok + CD)

Artnr. svenska versionen IPC-A-610-SE HARD COPY (bok), IPC-A-610-SE E (1) CD (CD), IPC-A-610-SE KIT (bok + CD)

Pris: Se vår webbshop

IPC-J-STD-001F Requirements for Soldered Electrical and Electronic Assemblies

J-STD-001F is recognized worldwide as the sole industry-consensus standard covering soldering materials and processes. This revision includes support for both traditional solder alloys and for lead-free manufacturing. Revision to plated-through hole, PTH, minimum fill requirements; criteria for two new SMT termination types; and expanded conformal coating criteria. Clarification of criteria descriptions for easier understanding. The requirements for all three classes of construction are included. Full color illustrations are provided for clarity. This standard fully complements IPC-A-610F and is supported by IPC-HDBK-001. 70 pages. Released July 2014.

Part No. J-STD-001 HARD COPY, J-STD-001 E(1) CD, J-STD-001-K KIT

IPC-J-STD-001E-SE (rev E 2010) Krav för lödda elektriska och elektroniska kretskort finns även på svenska. Översatt av Scanditron.

Artrnr. (svenska versionen). J-STD-001-SE HARD COPY, J-STD-001-SE E(1) CD, J-STD-001-SE-K KIT

Pris: Se vår webbshop

IPC-7711/7721C Rework, Modification and Repair of Electronic Assemblies

This guide includes all procedures needed for repair and rework of electronic assemblies and printed circuit boards! New rev C includes new procedures for BGAs using focused IR Reflow Systems with integral preheater and general updates to all other procedures. Many color illustrations. 396 pages. Released January 2017.
 
 
Part No. IPC-7711/21 HARD COPY, IPC-7711/21 (E)1 CD, IPC-7711/21 (D)1 download
 
 
 
Pris: Se vår webbshop

IPC-7095C Design and Assembly Process Implementation for BGAs

Implementing ball grid array (BGA) and fine-pitch ball grid array (FBGA) technology presents some unique challenges for design, assembly, inspection and repair personnel. IPC-7095C delivers useful and practical information to anyone currently using BGAs or FBGAs. Many issues have become especially important due to the change in the alloys of the ball, the ball shape, and the attachment procedures. The major emphasis of Revision C is to provide information on some of the new mechanical failure issues such as cratering or laminate defects caused after assembly.

In addition to providing guidelines for BGA inspection and repair, IPC-7095C addresses reliability issues and the use of lead-free joint criteria associated with BGAs. There are many photographs of X-ray and endoscope illustrations to identify some of the conditions that the industry is experiencing in the implementation of BGA assembly processes. 165 pages. Released January 2013.

Part No. IPC-7095 HARD COPY, IPC-7095 E(1) CD, IPC-7095-K KIT

 

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IPC-standarder för komponenter och övrigt material

IPC-HDBK-830A Guidelines for Design, Selection and Application of Conformal Coatings

This handbook is a compilation of the conformal coating industry's practical experience, and will assist the designers and users of conformal coatings in making informed choices. Users will better understand the properties of the various conformal coatings, the results to be achieved by its application and how to verify that these goals have been met. Use this document as a supplement in conjunction with the industry standard for qualification and quality conformance of conformal coating, IPC-CC-830. Revision "A" includes updated environmental and safety and use of conformal coating for tin whisker and fungus mitigation. 183 pages. Released October 2013.

Part No. IPC-HDBK-830 HARD COPY, IPC-HDBK-830 E(1) CD

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IPC-CC-830B Qualification of Electrical Insulating Compound

This is the industry standard for qualification and quality conformance of conformal coating. Its intent is to show how to obtain maximum information with minimum test redundancy. Includes requirements and evaluations of material properties using standardized test vehicles. Amendment 1 updates include new qualification, retention and conformance inspection requirements for FTIR, MIR and hydrolytic stability. 18 pages. Released October 2008.

Part No. IPC-CC-830 HARD COPY, IPC-CC-830 E(1) CD, IPC-CC-830-K KIT

Pris: Se vår webbshop

IPC-J-STD-033C Handling,Packing, Shipping and Use of Moisture Sensitive Surface Mount Devices

Provides surface mount device manufacturers and users with standardized methods for handling, packing, shipping and use of moisture/reflow sensitive components. These methods help avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation and damaged components. These procedures provide a minimum shelf life of 12 months from the seal date when properly implemented. Developed by IPC and JEDEC. 18 pages. Released February 2012.
 
Part No. J-STD-033 HARD COPY, J-STD-033 E(1) CD, J-STD-033-K KIT

 

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IPC-standarder för kablage

IPC-A-620C Acceptance for Cable and Wire Harness Assemblies

IPC-A-620 is the only industry-consensus standard for Requirements and Acceptance of Cable and Wire Harness Assemblies. IPC and the Wire Harness Manufacturers Association have continued to work together to develop this major update, adding lead free acceptance criteria, a new chapter devoted to electrical and mechanical testing, and enhanced criteria for molding and splicing.

Major update describing materials, methods, tests and acceptance criteria for producing crimped, mechanically secured and soldered interconnections and the related assembly activities. New sections for safety wiring, safety cable, grommets, and raceways along with updated information across many of the sections. Over 700 photographs and illustrations. 428 pages. Released January 2017. 

Part No. IPC-A-620C HARD COPY, IPC-A-620 (E)1 CD, IPC-A-620 (D)1 download
 

 

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IPC-testmetoder/renhet

IPC-CH-65B Guidelines for Cleaning of Printed Boards & Assemblies

Updated for new technologies including lead free, no-clean and environmentally friendly chemistries.
 
This is a collection of information on electronic board and assembly cleaning in a single location. This major revision explains the relationship between materials, processes and contaminants in fabrication and assembly operations. It also addresses cleanliness assessment and process control in relation to cleanliness. Color pictures help with understanding. 200 pages.Supersedes IPC-CH-65A, IPC-SC-60A, IPC-SA-61A, IPC-AC-62A, IPC-SM-839. Revised July 2011

Part No. IPC-CH-65 HARD COPY, IPC-CH-65 E(1) CD, IPC-CH-65-K KIT

 

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Beställ IPC standarder