Datacon 2220 evo plus multi-module attach die bonder

• Highest accuracy ± 7 µm @ 3 Sigma
• Uptime>98 %, yield > 99.95 %
• Die attach, flip chip, multichip in one single machine
• Die can be picked from wafers, waffle/gelpack, feeder and placed on boat, substrate, PCB, wafer, etc