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Datacon 2220 evo multi-chip die bonder
High accuracy ± 10 µm @ 3 Sigma
Dies can be picked from wafers, waffle/gelpack, feeder
Dies can be placed on boat, substrate, PCB, wafer, etc
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English
English
Polski
Svenska
Equipment
Material/Stencils
Automation
Support
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About us
Contact us
Webshop
Newsletter