Bonding/Soldering

Nordson DIMA Bonding and soldering

Nordson Dima offers a range of Hot Bar Systems from built-in Process Equipment via Desktop and Stand-Alone systems up to fully automated In-Line solutions for Reflow Soldering, Heat Staking, ACF Laminating and Heat Seal Bonding applications.

For example C-Base is a bench system combining C-Flow intelligent pulsed heater controller and C-Drive bond head.

• Displacement monitoring to control joining connections
• Multi-language user-friendly touchscreen user interface to easily transfer proven process globally
• Easy thermode change overs and planarity, which saves set up time
• Four distinct force ranges to apply accurate forces for all applications Integrated
• Force Control which can be easily programmed by the touch screen
• Data output to PC via RS-485 for Quality Assurance and SPC collection

For more information click on Read More or watch the video.

Via Scanditron only in Finland