Bonding/Soldering
Nordson DIMA Bonding and soldering
Nordson Dima offers a range of Hot Bar Systems from built-in Process Equipment via Desktop and Stand-Alone systems up to fully automated In-Line solutions for Reflow Soldering, Heat Staking, ACF Laminating and Heat Seal Bonding applications.
For example C-Base is a bench system combining C-Flow intelligent pulsed heater controller and C-Drive bond head.
- Displacement monitoring to control joining connections
- Multi-language user-friendly touchscreen user interface to easily transfer proven process globally
- Easy thermode change overs and planarity, which saves set up time
- Four distinct force ranges to apply accurate forces for all applications Integrated
- Force Control which can be easily programmed by the touch screen
- Data output to PC via RS-485 for Quality Assurance and SPC collection
For more information click on Read More or watch the video.
Via Scanditron only in Finland