Laser depaneling
LPKF CuttingMaster laser depaneling
CuttingMaster 2000 is a stress-free laser system for depaneling of rigid and flexible printed circuit boards. The cuts are precisely positioned, there is a high degree of design freedom, and the surrounding material remains free of mechanical stress.
- Cost effective compact system available
- The laser beam requires only a few µm as the cutting channel so more components can be placed on one panel
- Range of different laser powers and wave lengths for a working area of up to 350 mm x 350 mm
- UV laser which cuts clean edges in FR4, FR5, CEM, ceramic, polyimide, polyester and other PCB materials
LPKF MicroLine 2000
- Variants for high-precision machining of assembled PCBs, flexible boards and cover layers
- Cuts complex contures with highest accuracy
- UV laser which cuts clean with no thermal or mechanical stress
- Positioning accuracy +- 25µm
- Integrated vision system
- Easy integration into MES