Laser depaneling

LPKF laserskärning
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LPKF CuttingMaster laser depaneling

CuttingMaster 2000 is a stress-free laser system for depaneling of rigid and flexible printed circuit boards. The cuts are precisely positioned, there is a high degree of design freedom, and the surrounding material remains free of mechanical stress.

  • Cost effective compact system available
  • The laser beam requires only a few µm as the cutting channel so more components can be placed on one panel
  • Range of different laser powers and wave lengths for a working area of up to 350 mm x 350 mm
  • UV laser which cuts clean edges in FR4, FR5, CEM, ceramic, polyimide, polyester and other PCB materials
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LPKF Microline
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LPKF MicroLine 2000

  • Variants for high-precision machining of assembled PCBs, flexible boards and cover layers
  • Cuts complex contures with highest accuracy
  • UV laser which cuts clean with no thermal or mechanical stress
  • Positioning accuracy +- 25µm
  • Integrated vision system
  • Easy integration into MES

 

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