Microelectronics
Datacon 2220 evo multi-chip die bonder
- High accuracy ± 10 µm @ 3 Sigma
- Dies can be picked from wafers, waffle/gelpack, feeder
- Dies can be placed on boat, substrate, PCB, wafer, etc
Datacon 2220 evo plus multi-module attach die bonder
- Highest accuracy ± 7 µm @ 3 Sigma
- Uptime>98 %, yield > 99.95 %
- Die attach, flip chip, multichip in one single machine
- Die can be picked from wafers, waffle/gelpack, feeder and placed on boat, substrate, PCB, wafer, etc