Microelectronics

Datacon 2220 evo multi-chip die bonder

  • High accuracy ± 10 µm @ 3 Sigma
  • Dies can be picked from wafers, waffle/gelpack, feeder
  • Dies can be placed on boat, substrate, PCB, wafer, etc

Datacon 2220 evo plus multi-module attach die bonder

  • Highest accuracy ± 7 µm @ 3 Sigma
  • Uptime>98 %, yield > 99.95 %
  • Die attach, flip chip, multichip in one single machine
  • Die can be picked from wafers, waffle/gelpack, feeder and placed on boat, substrate, PCB, wafer, etc