Aluminium wire is used for low process temperatures, available as thick or fine wire
Fine small-wire available specially developed for chip-on-board (COB) applications
Heraeus small-diameter aluminium wedge bonding wire is made of high-quality AlSi1 alloy (99% aluminum and 1% silicon) and has the brand name of AlW-29S.
Very wide bonding process window
Conformity with all major bond test standards
Compliance with legal requirements including REACH and RoHS
