Heraeus aluminium bonding wires and ribbons

  • Aluminium wire is used for low process temperatures, available as thick or fine wire
  • Fine small-wire available specially developed for chip-on-board (COB) applications
  • Heraeus small-diameter aluminium wedge bonding wire is made of high-quality AlSi1 alloy (99% aluminum and 1% silicon) and has the brand name of AlW-29S.
  • Very wide bonding process window
  • Conformity with all major bond test standards
  • Compliance with legal requirements including REACH and RoHS
  • Raw materials of highest purity (99.999%)
  • Stable mechanical qualities
  • Made according to customer specifications