Bonding wire
Heraeus aluminium bonding wires and ribbons
- Aluminium wire is used for low process temperatures, available as thick or fine wire
- Fine small-wire available specially developed for chip-on-board (COB) applications
- Heraeus small-diameter aluminium wedge bonding wire is made of high-quality AlSi1 alloy (99% aluminum and 1% silicon) and has the brand name of AlW-29S.
- Very wide bonding process window
- Conformity with all major bond test standards
- Compliance with legal requirements including REACH and RoHS
- Raw materials of highest purity (99.999%)
- Stable mechanical qualities
- Made according to customer specifications
Heraeus gold bonding wire
- Heraeus offers a wide selection of ball, wedge and stud bonding wires in a varied portfolio of 4N 99.99 / 3N 99.9 / 2N 99.0.
- Raw materials of high purity (99,999 %)
- Stable mechancial qualities
- Wire surface of high quality
- Made according to customer specifications
- With a diameter down to a size of 0.6 mils / 15 microns for very fine applications.
- For ball or wedge bonding or stud bumping