Bonding wire

Heraeus aluminium bonding wires and ribbons

  • Aluminium wire is used for low process temperatures, available as thick or fine wire
  • Fine small-wire available specially developed for chip-on-board (COB) applications
  • Heraeus small-diameter aluminium wedge bonding wire is made of high-quality AlSi1 alloy (99% aluminum and 1% silicon) and has the brand name of AlW-29S.
  • Very wide bonding process window
  • Conformity with all major bond test standards
  • Compliance with legal requirements including REACH and RoHS
  • Raw materials of highest purity (99.999%)
  • Stable mechanical qualities
  • Made according to customer specifications

Heraeus gold bonding wire

  • Heraeus offers a wide selection of ball, wedge and stud bonding wires in a varied portfolio of 4N 99.99 / 3N 99.9 / 2N 99.0.
  • Raw materials of high purity (99,999 %)
  • Stable mechancial qualities
  • Wire surface of high quality
  • Made according to customer specifications
  • With a diameter down to a size of 0.6 mils / 15 microns for very fine applications.
  • For ball or wedge bonding or stud bumping